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[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Effect of hygro-thermo-mechanical stress on reliability of stacked die package
Zhu, Wenmin, Lai, Ping, Yang, ShaohuaYear:
2011
Language:
english
DOI:
10.1109/isapm.2011.6105700
File:
PDF, 193 KB
english, 2011