[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Shock resistant and thermally reliable low Ag SAC solder doped with Mn
Goudarzi, Vahid, Brown, Matthew, Liu, Weiping, Lee, Ning-Cheng, Lee, Jeffrey ChangBingYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756450
File:
PDF, 2.22 MB
english, 2013