[IEEE Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2004 - Brussels, Belgium (10-12 May 2004)] 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the - Void formation in a copper-via-structure depending on the stress free temperature and metallization geometry
Weide-Zaage, K., Dalleau, D., Danto, Y., Fremont, H.Year:
2004
Language:
english
DOI:
10.1109/esime.2004.1304065
File:
PDF, 1.11 MB
english, 2004