Design issues for interconnects in densely packaged RSFQ structures
Dimov, B., Ortlepp, T., Toepfer, H., Uhlmann, H.F.Volume:
13
Language:
english
Journal:
IEEE Transactions on Appiled Superconductivity
DOI:
10.1109/tasc.2003.813916
Date:
June, 2003
File:
PDF, 628 KB
english, 2003