![](/img/cover-not-exists.png)
[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Influence of lanthanum addition on microstructure and properties of Sn-3.5Ag solder system
Hwa-Teng Lee,, Yin-Fa Chen,, Ting-Fu Hong,, Yu-Jing Huang,Year:
2008
Language:
english
DOI:
10.1109/emap.2008.4784259
File:
PDF, 4.15 MB
english, 2008