[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Study of copper free air ball in thermosonic copper ball bonding
Chunjin Hanga,, Chunqing Wang,, Mingda Shi,, Xiaochun Wu,, Honghui Wang,Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564655
File:
PDF, 440 KB
english, 2005