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[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Simulation and experiments of fan-out wafer level package during encapsulation
Shang-Shiuan Deng,, Sheng-Jye Hwang,, Huei-Huang Lee,, Durn-Yuan Huang,, Yu-Ren Chen,, Geng-Shin Shen,Year:
2009
Language:
english
DOI:
10.1109/impact.2009.5382306
File:
PDF, 1.43 MB
english, 2009