[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Microstructural investigation on the interfacial evolution of SnBi/Cu interconnect during reflow and solid-state aging
Zhi-Quan Liu,, Pan-Ju Shang,, Xue-Yong Pang,, Jian-Ku Shang,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607072
File:
PDF, 1.41 MB
english, 2008