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[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Via Interconnections for Wafer Level Packaging: Impact of Tapered Via Shape and Via Geometry on Product Yield and Reliability
Shariff, Dzafir, Suthiwongsunthorn, Nathapong, Bieck, Florian, Leib, JurgenYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373899
File:
PDF, 4.29 MB
english, 2007