[IEEE 2011 IEEE 61st Electronic Components and Technology...

  • Main
  • [IEEE 2011 IEEE 61st Electronic...

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Vacuum underfill technology for advanced packaging

Horibe, A., Paquet, M.-C., Gaynes, M., Feger, C., Sakuma, K., Knickerbocker, J. U., Orii, Y., Hoshiyama, M., Hasegawa, M., Sato, T., Yoshii, H., Suzuki, O., Kotaka, K., Nagasaka, T., Terada, K., Ishik
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898632
File:
PDF, 734 KB
english, 2011
Conversion to is in progress
Conversion to is failed