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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Vacuum underfill technology for advanced packaging
Horibe, A., Paquet, M.-C., Gaynes, M., Feger, C., Sakuma, K., Knickerbocker, J. U., Orii, Y., Hoshiyama, M., Hasegawa, M., Sato, T., Yoshii, H., Suzuki, O., Kotaka, K., Nagasaka, T., Terada, K., IshikYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898632
File:
PDF, 734 KB
english, 2011