[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Large-scale Ge-on-Insulator wafers using low-temperature bonding and Epitaxial Lift-Off (ELO) technique
Mieda, E., Maeda, T., Yasuda, T., Maeda, A., Kurashima, Y., Takagi, H., Aoki, T., Yamamoto, T., Ichikawa, O., Osada, T., Hata, M., Ashihara, H., Waseda, T., Yugami, J., Kikuchi, T., Kunii, Y.Year:
2014
Language:
english
DOI:
10.1109/ltb-3d.2014.6886161
File:
PDF, 243 KB
english, 2014