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[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Mechanical properties of intermetallic compounds formed at the interface between a tin bump and an electroplated copper thin film
Jeong, Seongcheol, Sato, Yuki, Miura, HideoYear:
2008
Language:
english
DOI:
10.1109/emap.2008.4784251
File:
PDF, 4.11 MB
english, 2008