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[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Fatigue Life Evaluation of Lead-free Solder under Thermal and Mechanical Loads
Kim, Ilho, Lee, Soon-BokYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373782
File:
PDF, 5.35 MB
english, 2007