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[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Failure modes of Wafer Level Thin Film MEMS packages during wafer thinning
Zaal, J.J.M., van Driel, W.D., Zhang, G.Q.Year:
2010
Language:
english
DOI:
10.1109/esime.2010.5464595
File:
PDF, 18.71 MB
english, 2010