Foreword Special Section on Micro- and Nanoscale Packaging

IEEE Transactions on Advanced Packaging 2005 / 11 Vol. 28; Iss. 4

Foreword Special Section on Micro- and Nanoscale Packaging

Lee, Y.C., Chiou, J.A., Velten, T., Hancock, W.O.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2005.860786
Date:
November, 2005
File:
PDF, 466 KB
english, 2005
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