![](/img/cover-not-exists.png)
Chip-to-Chip Optoelectronics SOP on Organic Boards or Packages
Chang, G.-K., Guidotti, D., Liu, F., Chang, Y.-J., Huang, Z., Sundaram, V., Balaraman, D., Hegde, S., Tummala, R.R.Volume:
27
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2004.831880
Date:
May, 2004
File:
PDF, 1016 KB
english, 2004