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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Importance of Cu/Al Intermetallic coverage in copper wire bonding with sensitive pad structure
Tracy Jia Lin Yap,, Yin Kheng Au,, Poh Leng Eu,Year:
2012
Language:
english
DOI:
10.1109/emap.2012.6507906
File:
PDF, 781 KB
english, 2012