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[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Thermal Fatigue Reliability Modeling and Analysis of BGA Socket Assembly in System Board with Preloaded Use Condition
Liping Zhu,, Summers, M., Uppalapati, R., Clyne, K.Year:
2006
Language:
english
DOI:
10.1109/ectc.2006.1645741
File:
PDF, 786 KB
english, 2006