Analysis of a thermally enhanced ball grid array package

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1995 / Dec. Vol. 18; Iss. 4

Analysis of a thermally enhanced ball grid array package

Guenin, B.M., Marrs, R.C., Molnar, R.J.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.477460
Date:
January, 1995
File:
PDF, 895 KB
english, 1995
Conversion to is in progress
Conversion to is failed