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[IEEE 2006 International Microsystems, Package, Assembly Conference Taiwan - Grand Formosa Regent, Taipei, Taiwan (2006.10.18-2006.10.20)] 2006 International Microsystems, Package, Assembly Conference Taiwan - Lead-Free Flip Chip Package Reliability and the Finite Element-Factorial Design Methodology
Chiu, Chien-chia, Wu, Chung-jung, Peng, Chih-tang, Chiang, Kuo-ning, Ku, Terry, Cheng, KennyYear:
2006
Language:
english
DOI:
10.1109/impact.2006.312215
File:
PDF, 5.14 MB
english, 2006