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[IEEE 2008 2nd Electronics Systemintegration Technology Conference - Greenwich (2008.09.1-2008.09.4)] 2008 2nd Electronics Systemintegration Technology Conference - Flip chip based packaging solution for high current driver chips used in automotive applications
Vandevelde, B., Vandecasteele, B., Vanderstraeten, D., Brizar, G., Blansaer, E.Year:
2008
Language:
english
DOI:
10.1109/estc.2008.4684415
File:
PDF, 17.51 MB
english, 2008