[IEEE 2008 2nd Electronics Systemintegration Technology...

  • Main
  • [IEEE 2008 2nd Electronics...

[IEEE 2008 2nd Electronics Systemintegration Technology Conference - Greenwich (2008.09.1-2008.09.4)] 2008 2nd Electronics Systemintegration Technology Conference - Flip chip based packaging solution for high current driver chips used in automotive applications

Vandevelde, B., Vandecasteele, B., Vanderstraeten, D., Brizar, G., Blansaer, E.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2008
Language:
english
DOI:
10.1109/estc.2008.4684415
File:
PDF, 17.51 MB
english, 2008
Conversion to is in progress
Conversion to is failed