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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Design for Cyclic Bending Reliability of Large PBGA Assembly Using Experimental and Numerical Methods
Che, Fa Xing, Yap, Daniel, Luan, Jing En, Goh, Kim Yong, Ma, Yi YiYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763588
File:
PDF, 8.29 MB
english, 2008