[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - Reliability and Failure Mechanism of Current-Stressed 99.3Sn-0.7Cu/96.5Sn-3Ag-0.5Cu Composite Flip-Chip Solder Joints with Cu or Au/Ni/Cu Substrate Pad Metallization
Chiu, Ying-Ta, Shao, Yu-Hsiu, Lai, Yi-ShaoYear:
2008
Language:
english
DOI:
10.1109/impact.2008.4783805
File:
PDF, 3.77 MB
english, 2008