[IEEE 2010 2nd International Conference on Reliability, Safety and Hazard - Risk-Based Technologies and Physics-of-Failure Methods (ICRESH) - Mumbai, India (2010.12.14-2010.12.16)] 2010 2nd International Conference on Reliability, Safety and Hazard - Risk-Based Technologies and Physics-of-Failure Methods (ICRESH) - Finite element based thermal analysis of sealed electronic rack and validation
Taliyan, S. S., Sarkar, Suman, Biswas, B. B., Kumar, ManojYear:
2010
Language:
english
DOI:
10.1109/icresh.2010.5779590
File:
PDF, 2.53 MB
english, 2010