The effect of solder bump pitch on the underfill flow

IEEE Transactions on Advanced Packaging 2002 / 11 Vol. 25; Iss. 4

The effect of solder bump pitch on the underfill flow

Wen-Bin Young,, Wen-Lin Yang,
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Volume:
25
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2002.807564
Date:
November, 2002
File:
PDF, 633 KB
english, 2002
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