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[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - CPI assessment using a novel characterization technique based on bump-assisted scratch-indentation testing
Geisler, Holm, Lehr, Matthias U., Platz, Alexander, Kuchenmeister, Frank, Mayer, Ulrich, Rossler, Thomas, Paul, Jens, Lehmann, Lothar, Hofmann, Petra, Engelmann, Hans-JurgenYear:
2011
Language:
english
DOI:
10.1109/iitc.2011.5940308
File:
PDF, 3.56 MB
english, 2011