[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Electromigration of 96.5Sn-3Ag-0.5Cu Flip-chip Solder Bumps Bonded on Substrate Pads of Au/Ni/Cu or Cu Metallization

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