[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology
Eu Poh Leng,, Chin Teik Siong,, Lee Boon Seong,, Leong, Philip, Gunasekaran,, Song, James, Mock, KS, Siew, CW, Sivakumar,, Wong Boh Kid,, Weily, ChewYear:
2010
Language:
english
DOI:
10.1109/eptc.2010.5702688
File:
PDF, 1.05 MB
english, 2010