[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Considerations and benefits of plasma etch based wafer dicing
Barnett, Richard, Ansell, Oliver, Thomas, DaveYear:
2013
Language:
english
DOI:
10.1109/eptc.2013.6745784
File:
PDF, 1.10 MB
english, 2013