Thermal and Mechanical Analysis of High-Power LEDs With Ceramic Packages
Jianzheng Hu,, Lianqiao Yang,, Moo Whan Shin,Volume:
8
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2008.920298
Date:
June, 2008
File:
PDF, 693 KB
english, 2008