[IEEE 53rd Electronic Components and Technology Conference,...

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - High-density packaging technologies on silicon substrates

Akazawa, M., Kuramochi, S., Tomoko,, Maruyama,, Nakayama, K., Takano, A., Yamaguchi, M., Fukuoka, Y.

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Year:

2003

Language:

english

DOI:

10.1109/ectc.2003.1216350

File:

PDF, 704 KB

english, 2003

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