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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Synthesis of high purity o-cresol novolac epoxy resins
Xiao-Wei Tian,, Zhen-Guo Yang,, Jiang-yan Sun,, Zheng Ji,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607062
File:
PDF, 306 KB
english, 2008