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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - In-situ stress and warpage measurements to investigate reliability of flip-chip on board assembly without underfill
Bansal, S., Raj, P.M., Shinotani, K., Bhattacharya, S., Tummala, R., Lance, M.J.Year:
2003
Language:
english
DOI:
10.1109/ectc.2003.1216270
File:
PDF, 587 KB
english, 2003