[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Thermally enhanced 3 dimensional integrated circuit (TE3DIC) packaging
Snyder, S., Thompson, J., King, A., Walters, E., Tyler, P., Weatherspoon, M. R.Year:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897347
File:
PDF, 2.98 MB
english, 2014