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Solute pairing in solution-hardened Cu-Ni, Cu-Pd binary, and Cu-Ni-Pd ternary fcc alloys
Wong, Joe, Nixon, W. E., Mitchell, J. W., Laderman, S. S.Volume:
71
Year:
1992
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.350728
File:
PDF, 1.00 MB
english, 1992