Surface activated bonding of copper through silicon vias and gold stud bumps at room temperature
Howlader, M. M. R., Zhang, F., Deen, M. J., Suga, T., Yamauchi, A.Volume:
29
Year:
2011
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.3549114
File:
PDF, 1.16 MB
english, 2011