Fluorocarbon high-density plasmas. II. Silicon dioxide and silicon etching using CF4 and CHF3
Oehrlein, G. S.Volume:
12
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.578877
Date:
March, 1994
File:
PDF, 1.51 MB
english, 1994