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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Study on the heat dissipation of the thermal via in T/R modules based on BP-GA
Bi, Tang-wen, Zhou, De-jianYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066926
File:
PDF, 970 KB
english, 2011