[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - The use of modified oxide process for lead-free application
Lin, Williams, Lin, David, Hsu, Keven, Chang, K. S., Chu, CharleyYear:
2007
Language:
english
DOI:
10.1109/impact.2007.4433606
File:
PDF, 703 KB
english, 2007