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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - An improved model for predicting fatigue-crack propagation behaviors in multiple solder bumps on a BGA package
Terasaki, Takeshi, Tanie, Hisashi, Nakatsuka, Tetsuya, Kurauchi, Satoshi, Yamashita, Tadayuki, Furusawa, Yuichi, Imai, HironoriYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575654
File:
PDF, 1.57 MB
english, 2013