[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - A novel pair-based (2×2) technique for fast inductance extraction of narrow on-chip interconnects
Chakravarthy, S., Mazumder, M., Changhong Dai,Year:
2004
Language:
english
DOI:
10.1109/epep.2004.1407620
File:
PDF, 274 KB
english, 2004