[IEEE Electrical Performance of Electronic Packaging -...

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[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - A novel pair-based (2×2) technique for fast inductance extraction of narrow on-chip interconnects

Chakravarthy, S., Mazumder, M., Changhong Dai,
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Year:
2004
Language:
english
DOI:
10.1109/epep.2004.1407620
File:
PDF, 274 KB
english, 2004
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