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[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Solder extrusion solution and mold adhesion to die surface improvement with PI isolation design for FCOL exposed die technology
Teck Siang Lim,, Cheong, CH, Tan, SHYear:
2012
Language:
english
DOI:
10.1109/iemt.2012.6521763
File:
PDF, 2.03 MB
english, 2012