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[IEEE 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2013.10.27-2013.10.30)] 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems - Modeling methodologies for multi level PCB-package co-simulation & co-design
Scogna, Antonio Ciccomancini, Chiang, ChunTong, Lau, Linus, Teoh, LianKheng, Lee, HsuenYenYear:
2013
Language:
english
DOI:
10.1109/epeps.2013.6703466
File:
PDF, 123 KB
english, 2013