[IEEE 2009 4th IEEE Conference on Industrial Electronics and Applications (ICIEA) - Xian, China (2009.05.25-2009.05.27)] 2009 4th IEEE Conference on Industrial Electronics and Applications - Ultrasonic detection of debond in multi-layer adhesive structure based on wavelet-packet transform
Dun Yi,, Chen Jian-hui,, Gao Feng-qi,, Xu Zhang-sui,Year:
2009
Language:
english
DOI:
10.1109/iciea.2009.5138336
File:
PDF, 395 KB
english, 2009