[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - Expedient methodology for the quantification of interconnect-induced semiconductor substrate noise
Chung, I.J., Cangellaris, A.C.Year:
2004
Language:
english
DOI:
10.1109/epep.2004.1407607
File:
PDF, 271 KB
english, 2004