[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections
Das, Rabindra N., Papathomas, Konstantinos I., Lauffer, John M., Egitto, Frank D.Year:
2007
Language:
english
DOI:
10.1109/ectc.2007.373779
File:
PDF, 5.34 MB
english, 2007