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[IEEE 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Hose, CA, USA (2014.5.20-2014.5.23)] IEEE International Interconnect Technology Conference - Impact of die partitioning on reliability and yield of 3D DRAM
Kim, Woongrae, Kim, Dae-Hyun, Hong, Hee Il, Milor, Linda, Lim, Sung KyuYear:
2014
Language:
english
DOI:
10.1109/iitc.2014.6831841
File:
PDF, 401 KB
english, 2014