[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Fine pitch copper wire bonding on copper bond pad process optimization
Kan Wai Lam,, Hong Meng Ho,, Stoukatch, S., Van De Peer, M., Ratchev, P., Vath, C.J., Schervan, A., Beyne, E.Year:
2002
Language:
english
DOI:
10.1109/emap.2002.1188814
File:
PDF, 505 KB
english, 2002