[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Electroless Plating Ni-based Barrier Layers for 3D Interconnection
Cai, Jian, Feng, Guoqiang, Yang, Zhigang, Wang, Shuidi, Jia, SongliangYear:
2006
Language:
english
DOI:
10.1109/emap.2006.4430621
File:
PDF, 14.98 MB
english, 2006