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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Electroless Plating Ni-based Barrier Layers for 3D Interconnection

Cai, Jian, Feng, Guoqiang, Yang, Zhigang, Wang, Shuidi, Jia, Songliang
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Year:
2006
Language:
english
DOI:
10.1109/emap.2006.4430621
File:
PDF, 14.98 MB
english, 2006
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