[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Design for reliability in via middle and via last 3-D chipstacks incorporating TSVs
Trigg, A D, Li Hong Yu,, Xiong, Yong Zhong, Shi Jing Lin,, Cheng Cheng Kuo,, Navas Khan,, Teo Keng Hwa,, Gao Shan,Year:
2010
Language:
english
DOI:
10.1109/eptc.2010.5702657
File:
PDF, 2.13 MB
english, 2010